Q4 2025 Quarterly Market Insights - Flipbook - Page 6
Manufacturing &
Fab Expansion
Capital expenditure on semiconductor fabrication
and equipment remained a headline theme in
Q4 2025. Globally, 18 new fab projects are set
to break ground in 2025, spanning multiple regions
and technology nodes-including both 200mm
and 300 mm wafer facilities-underscoring
industry commitment to capacity growth and
geographic diversification.
Key Highlights
•
~18 new fab projects planned globally in
2025, across 200 mm and 300 mm wafers.
•
North America: Advanced and speciality fabs
supported by public funding.
•
Asia-Pacific: Continued expansion of mature
and specialised capacity.
•
Europe & Middle East: Selective fab
investments to improve regional resilience.
•
Texas Instruments: Ongoing 300mm
fab expansion for analogue and
embedded products.
•
Infineon: Accelerated power and SiC capacity
to support EV and electrification demand.
Simultaneously, semiconductor manufacturing
equipment demand remains robust, with projected
increases in wafer fab equipment (WFE) sales driven
by both advanced and mainstream technologies.
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