Q4 2025 Quarterly Market Insights - Flipbook - Page 16
ST Microelectronics
• STMicroelectronics and SpaceX celebrated a decade-long partnership powering Starlink connectivity with
co-designed chips manufactured across France, Malta, and Malaysia.
• STMicroelectronics expanded sustainable industrial infrastructure in Singapore with SP Group to deploy
the city-state’s largest district cooling system at its semiconductor facilities.
• STMicroelectronics introduced the new GANSPIN GaN IC platform, cutting motor drive system footprints
and enabling more efficient power electronics applications.
Toshiba
• Toshiba verified industry-first 12-disk stacking technology for 3.5-inch HDDs, enabling plans for 40 TB
data-center drives and boosting storage density roadmaps according to Tom’s Hardware.
• Toshiba launched the TCD2400DG lens-reduction CCD linear image sensor for high-speed industrial
image inspection applications, starting shipments in December 2025.
• Toshiba introduced Siemens EDA electronic design automation tools into its semiconductor design
workflows to accelerate next-generation power and analog device development.
Texas Instruments
• Texas Instruments opened a new assembly and test factory in Melaka, Malaysia to expand manufacturing
of analog and embedded chips.
• Texas Instruments began production at its newest 300 mm wafer fab in Sherman, Texas, significantly
boosting U.S. semiconductor manufacturing capacity.
• TI’s planned U.S. semiconductor expansion includes a multi-fab strategy partnering with major tech firms
to support foundational chip supply chains.
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