Q3 2026 Quarterly Market Insights[1] - Flipbook - Page 15
Renesas
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The July 28 Kumamoto earthquake temporarily disrupted production at affected Renesas facilities.
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Manufacturing has restarted in phases as the company works to restore normal wafer-input capacity.
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New Gen 3 DDR5 MRDIMM chipsets supporting up to 16,000 MT/s target AI and HPC systems.
Samsung
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Samsung is reportedly achieving HBM4E yields above 70% as production efficiency improves.
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Stronger relationships with major AI customers are supporting Samsung’s HBM4 supply
ambitions.
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Samsung is reportedly considering 2nm technology for HBM5 base dies as it advances its memory
roadmap.
Siemens
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Siemens agreed to acquire Precision Innovations to strengthen AI-powered chip planning and SoC
design.
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The planned Defacto Technologies acquisition will expand automated SoC design and RTL development
capabilities.
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Siemens and NVIDIA are developing agentic-AI workflows to automate and verify semiconductor and
PCB designs.
Company - Specific Updates
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