Q3 2026 Quarterly Market Insights[1] - Flipbook - Page 10
Company - Specific Updates
AMD
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AMD launched the EPYC 9006 series for agentic-AI and high-performance data-center workloads.
•
Spartan UltraScale+ SU200P FPGAs entered volume production for networking, robotics and industrial
applications.
•
A $4–5 billion debt offering will provide additional funding flexibility for AI and data-center
expansion.
Analog Devices
•
ADI completed its $200 million acquisition of Empower Semiconductor to expand its powermanagement portfolio for AI and high-performance systems.
•
Selected analog products are reportedly facing longer lead times as industrial and AI-related demand
strengthens.
•
Q3 results due August 19 should provide further visibility on demand, pricing and supply conditions.
Broadcom
•
Broadcom secured a multiyear agreement worth more than $30 billion to supply custom silicon and
connectivity components to Apple.
•
Around $1.5 billion will be invested in its Fort Collins facility to expand U.S. chip production.
•
High-end networking and PCIe-related products are reportedly experiencing extended market lead
times.
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