Q2 2025 Quarterly Market Insights 1 - Flipbook - Page 3
Diodes Inc.
• Diodes Incorporated has launched the industry’s first PCIe 6.0-compliant ReDriver, the PI3EQX64904, enabling
64GT/s PAM4 signal speeds with enhanced signal integrity for AI data centers, HPC, and networking applications.
• Diodes Incorporated has introduced the AH4930Q, its first automotive-compliant 12-bit I2C 3D linear Hall-effect
sensor for precise, contactless rotary motion and proximity detection in systems like infotainment controls and gear
shifters.
• Diodes Incorporated has launched its first InSb Hall element sensors - AHE300 and AHE10x series - offering ultrahigh sensitivity and low offset for accurate rotation and current detection in consumer and industrial applications.
Infineon
• Infineon will begin 300 mm GaN wafer production in Q4 2025, seizing market share as TSMC exits the GaN space
and aiming to meet booming demand with 2.3× higher chip yield than 200 mm processes.
• Infineon has launched its third-gen XENSIV™ 3D magnetic Hall-effect sensors for precise position detection in
automotive, industrial, and consumer applications, offering ASIL-B safety, wide temperature tolerance, and low
power operation.
• IDEMIA Secure Transactions and Infineon Technologies have formed a strategic partnership to revolutionize digital
car access with secure, scalable, and post-quantum-ready automotive solutions.
Intel
• Intel may scrap its 18A process node for foundry customers and shift focus to 14A, potentially leaving TSMC’s N2 and
A16 nodes without direct competition in the near term.
• Intel’s next-gen “Nova Lake-S” client CPU has taped out on TSMC’s 2nm (N2) node, signalling a hybrid manufacturing
strategy with Intel’s 18A process - likely a contingency plan for yield or capacity, with launch expected in H2 2026.
• Intel’s RealSense spins off as standalone firm, raises $50M to expand AI vision tech for robotics, with plans to scale
depth camera production, AI R&D, and global reach.
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