Monthly market insights - July 2026 - Flipbook - Page 4
Market Updates
New Fabs and Manufacturing Outlook - Several
major facilities are approaching key milestones
this half
Advanced Packaging and Capacity Expansion
Samsung - Taylor, Texas
•
Capacity projected to reach 200,000 wafers per
month by 2027
•
Packaging bottlenecks are expected to continue
into 2027
•
Risk production targeted for H2 2026
•
Full operations expected by end of 2026
TSMC CoWoS Packaging
Micron - Idaho, USA
Samsung & SK Hynix - South Korea
•
Manufacturing facility remains on track
•
Confirmed combined investment of KRW
800 trillion
•
Production scheduled to begin in 2027
•
New fab construction to ramp up over the
coming quarters
•
Additional manufacturing capacity expected
to come online progressively throughout
the remainder of the decade.
TSMC - Arizona Fab 2
•
Equipment installation starts in Q3 2026
•
High-volume 3nm production expected in 2027
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