Market Insights Q4 2024 Release - Report - Page 9
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NXP
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NXP's new i.MX 94 processors integrate multicore performance, AI capabilities, advanced security, and real-time networking to
address industrial and automotive edge challenges. Sampling will begin in Q1 2025.
NXP anticipates 8-12% growth in automotive and industrial IoT chip demand by 2027, driven by rising semiconductor content in cars,
despite global economic uncertainties and U.S.-China export curbs.
NXP and TSMC's Vanguard International are planning to expand their $7.8 billion Singapore chip plant, diversifying production amid
rising US-China tech tensions.
Onsemi
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onsemi will acquire Qorvo's SiC JFET technology for $115M to enhance energy-efficient power solutions for AI data centres and
emerging markets like EVs and SSCBs.
Onsemi's new silicon carbide power-integrated modules boost utility-scale solar inverter power to 350 kW, enhancing efficiency,
reducing costs, and enabling significant energy savings.
Onsemi CEO Hassane El-Khoury highlights the Treo platform for application-specific intelligent sensing, wide-bandgap materials like
GaN and SiC, and sustainable innovation through robust production and academic collaboration.
Panasonic
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Panasonic launches its BalancedHome Elite ERV series, offering versatile, efficient ventilation with SmartFlow technology and flexible
installation for single-family homes.
Panasonic's Cardiff plant now runs entirely on renewable energy with hydrogen fuel cells, solar, battery storage and showcasi ng
hydrogen innovation.
Rapidus
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Rapidus, collaborating with IBM, unveils groundbreaking 2nm chip tech as Japan boosts semiconductor security amid TSMC
dominance concerns.
Japan’s Rapidus to receive its first EUV machine in mid-December, marking a milestone in its journey to mass-produce 2nm chips by
2027, supported by ASML's new service centre in Hokkaido.
Renesas
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Renesas debuts RAA489118 charger and RAA489400 USB-C controller, delivering efficient, safe USB PD EPR solutions for power tools,
vacuums, and industrial applications.
Renesas and Nidec unveil the world's first "8-in-1" E-Axle system for EVs, integrating eight functions with a single MCU.
Renesas and Intel launch three power management ICs to enhance energy efficiency in next-gen AI-powered laptops.
Samsung
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Samsung unveils the Galaxy Book5 Pro with Intel Lunar Lake CPU, Galaxy AI, Copilot+, and AI-powered features like OCR, Photo
Remaster, and Note Assist.
Samsung's inability to supply HBM3E to NVIDIA in 2024 highlights challenges as SK hynix solidifies its market dominance with
advanced technologies and partnerships.
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